ReviewsIntel Lga 115cpu Coolers

Noctua NT-H1 3.5g SW Edition, Thermal Computer Paste with Spatula and Cleaning Wipes

Renowned premium-grade thermal compound for optimal heat transfer from the CPU or GPU to the heatsink.
more than 150 awards and recommendations.
SW (Spatula & Wipes) Edition with spatula for easy spreading and three NA-CW1 cleaning wipes (no extra thermal paste cleaner or thermal paste remover required)!.
For air and liquid coolers (DIY/AiO), can significantly lower temperatures compared to stock pastes on AMD Ryzen and Intel Core CPUs, AMD Radeon and Nvidia GeForce GPUs, PS4/PS5, Xbox, laptops, etc..
Trusted Noctua quality with excellent long-term stability: recommended storage time up to 3 years, recommended usage time on the CPU or GPU up to 5 years.
3.5g pack for around 3-20 applications (depending on CPU size, e.g. ~3 applications for TR4, ~15 for AM4 or LGA1700, ~20 for LGA1200).

Supports Intel Socket 130W LGA20XX/LGA1366/LGA115X/LGA775 and AMD Socket 125W AM4/AM3+/AM3/AM2+/AM2/FM2+/FM2/FM1.
4 sintered powder heatpipes directly touch the CPU surface.
Extra fan clips provided allow adding a second fan.
Can be easily installed without moving the motherboard.

CPU Socket: Skylake LGA 1151, Haswell LGA1150 and LGA1155/1156 up to TDP 95 Watts.
CPU Support: LGA 1155: Intel 2nd Generation Core i7-2600, i5-2500 series & Sandy Bridge Xeon Processors 1220, 1220L, 1225,1230, 1235, 1240, 1245, 1260L, 1270, 1275 & 1280.
CPU Support: LGA 1156: Intel Core i3 i3-530 & i3-540, Core i5 i5-650, i5-650, i5-660, i5-661 i5-670 & I5-750.
Material: Copper Base with Aluminum Stacked Fin with Heat Pipes.

Supports Intel Socket 130W LGA20XX/LGA1366/LGA115X/LGA775 and AMD Socket 125W AM4/AM3+/AM3/AM2+/AM2/FM2+/FM2/FM1.
4 sintered powder heatpipes directly touch the CPU surface.
Extra fan clips provided allow adding a second fan.
Can be easily installed without moving the motherboard.

Award-Winning Twin Tower Cooler, dual heatsinks and fans accelerate and enhance heat dissipation for top-tier high performance. 6 x 6mm heatpipes and copper plate base ensure heat from CPU and drop temps. Ideal for mainstream, gaming PC, even overclocking with high TDP processor(12900K, 12700K, 11900K, 11700K, 10900K, 10980XE, 9900k, 9700k, 9600k,3700x).
Asymmetrical design allows unrestricted use of any front high RAM slot, and cut-out fin design gives highly clearance(55mm) of rear RAM slot(LGA2011/2066). Standing only 155mm tall, the cooler fits most PC case on the market..
Using Kaze Flex II 120mm quiet fan(Fluid Dynamic Bearing), FUMA2 Rev.B uses two different thickness(25mm & 15mm) PWM fans rotating in opposite direction. This generates higher static pressure as well as stable airflow thus pushing cooling performance to maximum while keeping silent operation. Addition fan clips is included to add 3rd fan..
Premium HPMS IV provides Fuma 2 Rev.B with easy-to-install experience and highly secure for CPU cooler socket INTEL LGA 1700 / LGA1200 / LGA115x / LGA2066 / LGA2011(V3) AMD AM4 / AM3(+) / AM2(+) / FM(+) / FM1.

Renowned premium-grade thermal compound for optimal heat-transfer from the CPU or GPU to the heatsink.
more than 150 awards and recommendations.
Easy to apply (no need to spread before heatsink installation) and easy to clean with dry paper towel or tissue (no cleaning alcohol required).
For air and liquid coolers (DIY/AiO), can significantly lower temperatures compared to stock pastes on AMD Ryzen and Intel Core CPUs, AMD Radeon and Nvidia GeForce GPUs, PS4/PS5, Xbox, laptops, etc..
Trusted Noctua quality with excellent long-term stability: recommended storage time up to 3 years, recommended usage time on the CPU up to 5 years.
10g pack for around 9-60 applications (depending on CPU size, e.g. ~9 applications for TR4, ~60 for LGA1200).

CPU Socket: Intel LGA 115X (1150 1151 1155 1156).
Application platform:Intel Core i7-2600, i5-2500 series ,Intel Core i3& i5,Xeon Processor 3400 Series.
Full Size :89mm x 89mm x 50mm / Mounting hole distance:75mm x 75mm.
Heatsink Material:Copper / Heatsink processing technology:skiving fin.
Cooling fan:7020 cooling fan,DC 12V,dual ball bearing ,4pin with PWM / Speed Reference:4300RPM.

64GB Unbuffer Non-ECC UDIMM, DDR4-3200MHz (OC), in 4 DIMM slots.
1 PCI-E 3.0 x16, 1 PCI-E 3.0 x4, 1 PCI-E 3.0 x1.
Intel Z170 Express controller for 6 SATA3 (6 Gbps) ports.
RAID 0,1,5,10 + 1 PCIe M.2(PCIe x4, 2260/2280/22110)(No Raid Support).
Single LAN with Intel single Ethernet PHY i219V.
Intel 6th Generation Core i3 series/Core i5 series/ Core i7 series, Socket H4 (LGA 1151) supported.
6 USB 3.0 ports (4 rear + 2 via header), 4 USB 2.0 ports (2 rear + 2 via headers),2 USB 3.1 (10 Gb/s) ports(Headers).

Premium-grade thermal compound for optimal heat-transfer from the CPU or GPU to the heatsink.
second generation of Noctua’s award-winning NT-H1.
Easy to apply (no need to spread before heatsink installation) and easy to clean with supplied NA-CW1 cleaning wipes.
For air and liquid coolers (DIY/AiO), can significantly lower temperatures compared to stock pastes on AMD Ryzen and Intel Core CPUs, AMD Radeon and Nvidia GeForce GPUs, PS4/PS5, Xbox, laptops, etc..
Trusted Noctua quality with excellent long-term stability: recommended storage time up to 3 years, recommended usage time on the CPU up to 5 years.
10g pack for around 9-60 applications (depending on CPU size, e.g. ~9 applications for TR4, ~60 for LGA1200).

【4Pin PWM Fan for Intelligent Speed Control】Full function 120mm 12V 4Pin PWM fan silentpro blades design for excellent airflow and convenient automatic speed control, at 1000~1800±10%RPM. Hydraulic bearing can reduce oil spillage and friction, reduce noise and maintain efficient operation. Silent and shock absorbing..
【Top Brower Air Cooling CPU Cooler with Blue LEDs】Moonlight series top brower air cooling CPU cooler, cool and striking LED corona blue lighting frame design makes your pc case unique..
【Black Plating Anti-oxidation Protective Layer】Black plating anti-oxidation protective layer surface treatment helps prevent corrosion, provide better heat dissipation and can effectively utilize the air at the edge of the fan to improve overall heat dissipation. Well-balanced cooling performance provides fin optimizations with perfect balance between high and low speed operations..
【Matrix Interleaved Fin Compressed Design】Aluminum heatsink with fin compressed design and larger heat dissipation area for more cooling. The compacting process allows each fin to be in intimate contact with the CPU for rapid heat dissipation and more cooling. Support up to 92W TDP Processor, provide excellent heat dissipation..