Thermal Pad 12.5 W/mK, 298X298X3.0mm, TG-A1250 High Thermal Conductivity, Heat Sink Cooling Pad, for PC Laptop/GPU/CPU, Electrical Insulation
- Good Thermal Conductivity Ability - Using the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material..
- Outstanding performance - Low thermal resistance & Electrical insulation.
- Safe and easy to use - You can choose a suitable thickness of thermal pad according to the gap between the heating source and the heat sink. It can be cut to size and easy to install, replacing the traditional thermal paste..
- Application - Best for high power applications, high-wattage electronics such as electric vehicles, automation, 5G applications, servers, etc..